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Alumina Boron Nitride

Alumina Boron Nitride

Alumina boron nitride composite ceramics are made of BN and AIN materials by hot press sintering process.

Description

DMCERA® Alumina Boron Nitride

Aluminum nitride has high thermal conductivity,reliable electrical insulation,good electrical properties and excellent mechanical properties.It is a very promising semiconductor substrate material and packaging material for high-power electronic devices, but it has the problems of high hardness and difficult machining.

Hexagonal boron nitride ceramic has reliable electrical insulation, good self-lubrication, thermal shock resistance, chemical corrosion resistance,and easy machining.It has been successfully applied in many fields, but the thermal conductivity is low, and the mechanical strength and hardness are not high.

The combination of AlN and h-BN can achieve complementary advantages and obtain alumina boron nitride with excellent comprehensive performance.

Advantages:

● High relative density.
● Low dielectric loss.
● Low dielectric constant.
● Excellent wear resistance and corrosion resistance.

Applications:

● Setter plate.
● Jig material for molding glass.
● Powder metal atomization nozzle.
● Component for semiconductor equipment.

Specifications:

Grade

BN-AN

Compositions

BN+AIN

Density

g/cm3

2.5-2.6

25°C Volume Resistivity

Ω·cm

>1014

Max. Service Temp. (°C)

Oxygen

900

Inert Gas

2100

High Vacuum

1900

Flexural Strength

Mpa

130

Compressive Strength

Mpa

250

Coefficient of Thermal Expansion 25-1000°C

10-6/K

4.5

Thermal Conductivity

W/mK

60


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